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Tungsten Copper Heat Sink
Our tungsten copper composites to be used extensively in thermal mounting plates, chip carriers, flanges.
Products Introduce
Tungsten Copper high performance composites are fabricated from carefully controlled porous tungsten that is vacuum infiltrated with molten copper. This results in a WCu composite that has high conductivity and a matched low thermal expansion for heat sinks.
It is a composite of tungsten and copper. By controlling the content of tungsten, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.
Advantages: High thermal conductivity, Excellent hermeticity, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available of properties of WCu and MoCu heat materials.
Our tungsten copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make tungsten copper alloy an excellent choice even for extremely dense circuits.
The CuW75 tungsten copper alloy is used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper's thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits
